2025-04-11
The following are several common ceramics used as heating elements:
Alumina ceramics: Although the thermal conductivity of alumina ceramic substrates is not high (20W/m.K), it has become a widely used ceramic substrate due to its relatively simple production process, low cost and low price.
Aluminum nitride ceramics: Aluminum nitride ceramics have the characteristics of high thermal conductivity, low dielectric constant and dielectric loss, good chemical stability and wettability with metals, and are ideal electronic packaging and heat dissipation materials.
Silicon carbide ceramics: Silicon carbide ceramics have the characteristics of high thermal conductivity, high strength, high hardness, wear resistance, corrosion resistance, etc., and are ideal materials for manufacturing high-temperature structural parts and wear-resistant parts1.
Beryllium oxide ceramics: Beryllium oxide ceramics have the characteristics of high thermal conductivity, low dielectric constant and dielectric loss, good chemical stability and wettability with metals, and are ideal electronic packaging and heat dissipation materials.
Boron nitride ceramics: Boron nitride ceramics have the characteristics of high thermal conductivity, low dielectric constant and dielectric loss, good chemical stability and wettability with metals, and are ideal electronic packaging and heat dissipation materials.
Zirconia ceramics: Zirconia ceramics have the characteristics of high toughness, high hardness, wear resistance, corrosion resistance, etc., and are ideal materials for manufacturing tools, molds and structural parts.
Glass ceramics: Glass ceramics have the characteristics of high thermal conductivity, low dielectric constant and dielectric loss, good chemical stability and wettability with metals, and are ideal electronic packaging and heat dissipation materials1.
All of the above ceramic materials have good electrical insulation properties and high temperature resistance, so they are widely used in various heating elements.